Adapting High-Speed I/O System For EDA Cloud Computing Platform (ART/335CP) | ASTRI - Hong Kong Applied Science And Technology Research Institute Company Limited

Project Title:

Adapting High-Speed I/O System for EDA Cloud Computing Platform (ART/335CP)

Project Reference:

ART/335CP

Project Type:

Platform

Project Period:

08 / 12 / 2021 - 07 / 08 / 2023

Funds Approved (HK$’000):

9,740.270

Project Coordinator:

Dr Beiping YAN

Deputy Project Coordinator:

Deliverable:

Research Group:

Sponsor:

SMIT Systemic (HK) Limited (Contract Service)
L Lab Corporation (Hong Kong) Limited (sponsorship)

Description:

EDA (Electronic Design Automation) has penetrated every aspect of the IC industry. It is thought of as a fulcrum of digital economy, because it has pried up semiconductor industry by more than 400 billion dollar and the entire electronic system industry behind trillions of dollars. No EDA, no today’s IC industry. EDA cloud computing chip design is a trend for IC industry. Cloud computing chip design enables industry-wide collaboration among design verification, tape-out and manufacture. This project is going to develop adapting high-speed I/O system (or adaptor) to support EDA cloud computing platform. As a key component, the I/O system can ensure high-speed data transmission between emulator and cloud end. EDA cloud computing chip design is an emerging technology. Adoption of this technology will have a significant impact on IC industry. It not only can build a semiconductor industry chain collaborative service platform by joining upstream and downstream partners, but also can help IC enterprises to reduce cost and time to market, greatly enhancing their competitiveness.

Co-Applicant:

Keywords:

More about ASTRI

Hong Kong Applied Science and Technology Research Institute (ASTRI) was founded by the Government of the Hong Kong Special Administrative Region in 2000 with the mission of enhancing Hong Kong’s competitiveness through applied research. ASTRI’s core R&D competence in various areas is grouped under five Technology Divisions: Advanced Electronic Components and Systems; Artificial Intelligence and Trust Technologies; Communications Technologies; Innovative Mind; and IoT Sensing and AI Technologies. It is applied across six core areas which are Smart City, Financial Technologies, New Industrialisation and Intelligent Manufacturing, Digital Health, Application Specific Integrated Circuits and Metaverse.

Over the years, ASTRI has nurtured a pool of research, I&T talents and received numerous international awards for its pioneering innovations as well as outstanding business and community contributions. As of 2023/24, ASTRI has transferred more than 1,500 technologies to the industry and has been granted over 1,100 patents in the Mainland, the US, and other countries.

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